制造能力
奔强科技深耕PCB原型和小批量制造领域已逾15年。凭借可靠的交付表现和持续的技术创新，公司已发展成为该领域的领先供应商。自2017年起，奔强科技战略性地聚焦高端HDI技术，通过持续投入与能力升级，在先进工艺、快速交货和稳定质量的基础上，确立了在HDI原型和小批量制造领域的领先地位。
制造能力
印刷电路板
| Items | Standard | Prototype |
| Maximum Layer Count | 36 | 60 |
| Maximum Board Thickness | 6 mm | 8 mm |
| Outer Layer Line Width / Spacing | 3.5 / 3.5 mil | 3.0 / 3.5 mil |
| Inner Layer Line Width / Spacing [1 oz Cu] | 3.5 / 3.5 mil | 3.0 / 3.5 mil |
| Inner Layer Line Width / Spacing [H oz Cu] | 2.8 / 2.8 mil | 2.5 / 2.5 mil |
| Line Width / Spacing [2 oz Cu] | 6/6mil | 5.5/5.5mil |
| Line Width / Spacing [3 oz Cu] | 8/8mil | 7/7mil |
| Line Width / Spacing [4 oz Cu] | 10/10mil | 9/9mil |
| Line Width / Spacing [5 oz Cu] | 12/12mil | 11/11mil |
| Line Width / Spacing [6 oz Cu] | 14/14mil | 13/13mil |
| Aspect Ratio | 20:1 | 25:1 |
| HDI Structure | 3 + N + 3 | 7 + N + 7 |
| Differential Impedance Tolerance | ±10% (Inner Layer, 1 oz Cu) | ±5% (Inner Layer, 1 oz Cu) |
| Gold Finger Bevel Tolerance | ±0.075 mm | ±0.05 mm |
| Registration Accuracy | 4.5 mil | 4 mil |
| Maximum Back Drill Stub | 8 mil | 6 mil |
| Minimum Drill Hole Diameter | 7 mil | 7 mil |
| Surface Treatment | ENIG,HASL (with/without lead),OSP,Immersion Tin,Immersion Silver,ENEPIG,Gold Fingers,Selective Gold | |
刚柔结合板
| Item | Standard | Prototype | |
| Layer Count | Flexible Area | Max 10 Layers | Max 20 Layers |
| Rigid Area | Max 14 Layers | Max 26 Layers | |
| Board Thickness | Flexible Area | Min 0.15 mm | Min 0.10 mm |
| Rigid Area | 0.6 – 2.0 mm | 0.5 – 6.0 mm | |
| Copper Thickness | Inner Layers | Max 1 oz | Max 2 oz |
| Outer Layers | 0.5 – 1 oz | 0.5 – 6 oz | |
| Maximum Size | Panel Size | 220 × 450 mm | 280 × 810 mm |
| Minimum Line Width / Spacing | Inner Layers | 4 / 4 mil | 2.5 / 2.5 mil |
| Outer Layers | 4 / 4 mil | 2.5 / 2.5 mil | |
| Minimum Hole Size / Pad | Flexible Area | 0.15 mm / 0.45 mm | 0.15 mm / 0.45 mm |
| Rigid Area | 0.20 mm / 0.50 mm | 0.15 mm / 0.40 mm | |
| Aspect Ratio | Laser Via | 0.8 : 1 | 1:01 |
| Mechanical Through Hole | 12:01 | 15:01 | |
| Minimum Dielectric Thickness | Inner Layer Flexible Core | 0.025 mm | 0.0125 mm |
| Inner Layer Rigid Core | 0.1 mm | 0.1 mm | |
| Prepreg | 0.075 mm | 0.05 mm | |
| Dimensional Tolerance | Rigid Area Outline | ±0.15 mm | ±0.10 mm |
| Flexible Area Outline | ±0.10 mm | ±0.075 mm | |
| Minimum Flexible Board Length | 2 mm | 2 mm | |
| HDI Capability | 3 + N + 3 | 5 + N + 5 | |
| Minimum Hole-to-Trace | 7 mil | 5 mil | |
| Minimum Hole-to-Flex-Rigid Edge | ≥1.0 mm | ≥0.8 mm | |
| Surface Treatment | ENIG, Electrolytic Gold, HASL (with/without lead), OSP, Immersion Tin, ENEPIG, Immersion Silver | ||
材料
| Porduct | CCL Supplier | Laminate Model | Feature | Application |
| PCB |  |
S1000-2M | High Tg, High Performance, Low CTE | Computer，Communication，Automotive electronics，Suitable for high multilayer PCB |
| S1000H | High Performance, Mid-Tg, Lead-free | Instruments，Computer，Consumer electronics，Automotive electronics，Power supplier and Industrial | ||
| S1150G | Halogen-free, Mid-Tg | LED，Tablet，Smartphone，Automotive electronics，Communication equipment | ||
| S1170G | High Tg, Halogen-free | Computer，Instrument，Smartphone，Consumer electronics，Automotive electronics | ||
 |
ThunderClad 1+ | High Tg， halogen free， low loss | Backplane，Servers, Telecom, Base station，High performance computing | |
| ThunderClad 2 | High Tg， halogen free， low loss | Radio frequency，Backplane，Servers, Telecom, Base station，High performance computing | ||
| ThunderClad 3+ | PTFE-based, hydrocarbon-based very low loss materials | Radio frequency，Backplane，Servers, Telecom, Base station，High performance computing | ||
| TU-768 | High Tg | Consumer Electronics，Server, workstation，Automotive electronics | ||
| TU-862 HF | High Tg，Halogen Free | Backpanel，Servers, Telecom, Base station，Office Routers，High performance computing | ||
| TU-872 SLK | Low Dk，Low Df | Radio frequency，Backplane，Servers, Telecom, Base station，High performance computing | ||
 |
RO4350B/RO4003C | Low Dk，Low Df | Cellular Base Station Antennas，Power Amplifiers，RFIDAutomotive Radar and Sensors, LNBs | |
| RO3003 | Low Dk，Low Df | Direct broadcast satellites,power amplifiers and antennas,Remote meter readers,Patch antenna for wireless communications,Automotive radar applications |
||
| FPC |  |
AP8515R | PI=1mil,CU=0.5/0.5 OZ | / |
| AP8525R | PI=2mil,CU=0.5/0.5 OZ | / | ||
| AP8535R | PI=3mil,CU=0.5/0.5 OZ | / | ||
| AP9121R | PI=2mil,CU=1/1 OZ | / | ||
| AP9131R | PI=3mil,CU=1/1 OZ | / | ||
 |
R-F775 12RB-M | PI=1mil,CU=0.5/0.5 OZ | / | |
| R-F775 11RB-M | PI=1mil,CU=1/1 OZ | / | ||
| R-F775 22RB-M | PI=2mil,CU=0.5/0.5 OZ | / | ||
| R-F775 21RB-M | PI=2mil,CU=1/1 OZ | / | ||
 |
AS2L-AD250BU | PI=1mil,CU=0.5/0.5 OZ | / | |
| AS2L-AD500BU | PI=2mil,CU=0.5/0.5 OZ | / | ||
| AS2L-AD750BU | PI=3mil,CU=0.5/0.5 OZ | / | ||
| AS2L-AD251BE | PI=1mil,CU=1/1 OZ | / | ||
| AS2L-AD501BE | PI=2mil,CU=1/1 OZ | / | ||
| AS2L-AD751BE | PI=3mil,CU=1/1 OZ | / |
奔强科技是一家专业的PCB和PCBA制造商，致力于高质量的样品制作以及中小批量生产。
